VIA VX700芯片组 技术摘要
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VIA VX700芯片组技术摘要.
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VIA VX700 Mobile Chipset
Single-Chipset IGP Solution for the
VIA Ultra Mobile Platform
Making Your World Portable
Technology Brief
VIA Technologies, Inc.
July 2006VIA VX700
Making Your World Portable
Contents
Introduction.........................................................................................2
Enabling Smaller Form Factors.............................................................3
Reduced Power Consumption...............................................................3
Power Efficiency..................................................................................3
Advanced Power Management Features..............................................4
Reduced Heat......................................................................................5
Easier Cooling.....................................................................................5
Increased Performance........................................................................5
Advanced Single Chip Architecture......................................................5
High Levels of Feature Integration......................................................5
VIA VX700 Core Logic Overview...........................................................7
Advanced Multimedia Features ...........................................................7
VIA UniChrome™ Pro II IGP Graphics Core.....................................................7
2D/3D Engine ............................................................................................7
2D/3D Acceleration.....................................................................................7
Chromotion Video Engine.............................................................................7
MPEG-2/MPEG-4 Decoding Acceleration..........................................................8
Windows Media Video 9 (WMV9) Decoding Acceleration....................................8
Outputs: Delivering the Hi-Def™ Experience.......................................9
HDTV Support............................................................................................9
LVDS/DVI Support......................................................................................9
Video Capture............................................................................................9
DuoView+™...............................................................................................9
VIA Vinyl HD Audio...................................................................................10
Advanced Memory Controller............................................................10
High Performance CPU Interface.................................................................10
VIA DriveStation™ Controller Suite...................................................10
VIA DriveStation™ Serial ATA Controller.......................................................10
Multiple SATA Ports...................................................................................11
DriveStation™ Parallel ATA-133 Controller....................................................11
Advanced Connectivity Suite.............................................................11
USB 2.0..................................................................................................11
PCI Interface & LPC Bus.............................................................................11
VIA Ultra Mobile Platform...................................................................12
Conclusion..........................................................................................13
Copyright © VIA Technologies, Inc, 2006.
Third party brands and names are the property of their respective owner.
1VIA VX700
Making Your World Portable
Introduction
UMPCs (Ultra Mobile PCs) is an exciting new category of devices that can fit
comfortably into a pocket or handbag, enabling users to access and interact with their
entire digital world wherever they go. Continuing VIA’s philosophy of “Small is
Beautiful”, the VIA VX700 chipset is a crucial building block in the VIA Ultra Mobile
platform ideally complementing the VIA C7®-M processor to inspire an exciting new
category of UMPC (Ultra Mobile PC)
devices.
Creating exciting opportunities for
entertainment, productivity, and
communication focused products the VIA
VX700 chipset enables reduction of
mobile form factors by up to 40%. As the
first single chip implementation of its
kind for ultra mobile devices, the VIA VX700 continues VIA’s history of chipset
innovation and blazes a strong path for a new breed of digital companions.
By integrating the traditional chipset North Bridge and South Bridge into a single-chip
solution a number of advantages can be realized including:
Smaller form factors
Reduced power consumption
Less heat and easier cooling
Better performance
Copyright © VIA Technologies, Inc, 2006.
Third party brands and names are the property of their respective owner.
2VIA VX700
Making Your World Portable
Enabling Smaller Form Factors
The VIA VX700 is a highly compact single chip solution designed specifically for
today’s ultra mobile devices designed to fit comfortably into a pocket or handbag
enabling users to access and interact with their entire digital world wherever they go..
Combining the full functionality of a traditional North Bridge and South Bridge into a
Flip Chip BGA package measuring just 35mmx35mm, the VIA VX700 represents a
saving of more than 42% in silicon real estate, enabling for more simplified board
layouts and more room for additional onboard features. The host of leading digital
media, memory and connectivity technologies packed into the single-chip package of
the VIA VX700 also limits the need for additional add-on chips by system builders,
reducing complexity and cost.
Solution Provider VIA Intel
Platform Solution VIA C7-M ULV Pentium-M ULV + 915GMS +
+ VX700 ICH6-M
CPU Size 21x21mm2 35x35mm2
North Bridge Size 35x35mm2 27x27mm2
South Bridge Size - 31x31mm2
Total Silicon Real Estate 1666mm2 2915mm2
Reduced Power Consumption
Ultra portability requires extreme levels of power efficiency, unprecedented
performance per watt and advanced power management to enable efficient battery
usage, and cool handling, while still retaining good performance. The VIA VX700
features VIA’s signature power efficiency technologies that are further
complemented by the VIA C7-M processor.
Power Efficiency
With its highly integrated single chip architecture, the VIA VX700 was designed
Single-Chipset IGP Solution for the
VIA Ultra Mobile Platform
Making Your World Portable
Technology Brief
VIA Technologies, Inc.
July 2006VIA VX700
Making Your World Portable
Contents
Introduction.........................................................................................2
Enabling Smaller Form Factors.............................................................3
Reduced Power Consumption...............................................................3
Power Efficiency..................................................................................3
Advanced Power Management Features..............................................4
Reduced Heat......................................................................................5
Easier Cooling.....................................................................................5
Increased Performance........................................................................5
Advanced Single Chip Architecture......................................................5
High Levels of Feature Integration......................................................5
VIA VX700 Core Logic Overview...........................................................7
Advanced Multimedia Features ...........................................................7
VIA UniChrome™ Pro II IGP Graphics Core.....................................................7
2D/3D Engine ............................................................................................7
2D/3D Acceleration.....................................................................................7
Chromotion Video Engine.............................................................................7
MPEG-2/MPEG-4 Decoding Acceleration..........................................................8
Windows Media Video 9 (WMV9) Decoding Acceleration....................................8
Outputs: Delivering the Hi-Def™ Experience.......................................9
HDTV Support............................................................................................9
LVDS/DVI Support......................................................................................9
Video Capture............................................................................................9
DuoView+™...............................................................................................9
VIA Vinyl HD Audio...................................................................................10
Advanced Memory Controller............................................................10
High Performance CPU Interface.................................................................10
VIA DriveStation™ Controller Suite...................................................10
VIA DriveStation™ Serial ATA Controller.......................................................10
Multiple SATA Ports...................................................................................11
DriveStation™ Parallel ATA-133 Controller....................................................11
Advanced Connectivity Suite.............................................................11
USB 2.0..................................................................................................11
PCI Interface & LPC Bus.............................................................................11
VIA Ultra Mobile Platform...................................................................12
Conclusion..........................................................................................13
Copyright © VIA Technologies, Inc, 2006.
Third party brands and names are the property of their respective owner.
1VIA VX700
Making Your World Portable
Introduction
UMPCs (Ultra Mobile PCs) is an exciting new category of devices that can fit
comfortably into a pocket or handbag, enabling users to access and interact with their
entire digital world wherever they go. Continuing VIA’s philosophy of “Small is
Beautiful”, the VIA VX700 chipset is a crucial building block in the VIA Ultra Mobile
platform ideally complementing the VIA C7®-M processor to inspire an exciting new
category of UMPC (Ultra Mobile PC)
devices.
Creating exciting opportunities for
entertainment, productivity, and
communication focused products the VIA
VX700 chipset enables reduction of
mobile form factors by up to 40%. As the
first single chip implementation of its
kind for ultra mobile devices, the VIA VX700 continues VIA’s history of chipset
innovation and blazes a strong path for a new breed of digital companions.
By integrating the traditional chipset North Bridge and South Bridge into a single-chip
solution a number of advantages can be realized including:
Smaller form factors
Reduced power consumption
Less heat and easier cooling
Better performance
Copyright © VIA Technologies, Inc, 2006.
Third party brands and names are the property of their respective owner.
2VIA VX700
Making Your World Portable
Enabling Smaller Form Factors
The VIA VX700 is a highly compact single chip solution designed specifically for
today’s ultra mobile devices designed to fit comfortably into a pocket or handbag
enabling users to access and interact with their entire digital world wherever they go..
Combining the full functionality of a traditional North Bridge and South Bridge into a
Flip Chip BGA package measuring just 35mmx35mm, the VIA VX700 represents a
saving of more than 42% in silicon real estate, enabling for more simplified board
layouts and more room for additional onboard features. The host of leading digital
media, memory and connectivity technologies packed into the single-chip package of
the VIA VX700 also limits the need for additional add-on chips by system builders,
reducing complexity and cost.
Solution Provider VIA Intel
Platform Solution VIA C7-M ULV Pentium-M ULV + 915GMS +
+ VX700 ICH6-M
CPU Size 21x21mm2 35x35mm2
North Bridge Size 35x35mm2 27x27mm2
South Bridge Size - 31x31mm2
Total Silicon Real Estate 1666mm2 2915mm2
Reduced Power Consumption
Ultra portability requires extreme levels of power efficiency, unprecedented
performance per watt and advanced power management to enable efficient battery
usage, and cool handling, while still retaining good performance. The VIA VX700
features VIA’s signature power efficiency technologies that are further
complemented by the VIA C7-M processor.
Power Efficiency
With its highly integrated single chip architecture, the VIA VX700 was designed
AIGCVIA VX700芯片组是一款专为计算机主板设计的高性能整合芯片，它将处理器、图形处理核心（GPU）、南桥以及其他必要功能如USB、PCI-E接口、SATA接口等集成在一块硅片上，实现了系统级的硬件整合。这款芯片组主要应用于台式机和笔记本电脑市场，旨在简化PC平台的组件配置，提高系统效能并降低生产成本。
技术摘要方面，VX700采用了先进的ASIC（Application Specific Integrated Circuit）工艺制造，具备高速的南北桥数据交换能力以及对多核处理器的良好支持，能够提供流畅的游戏体验和高清视频解码性能。其集成的图形核心通常采用PowerVR或VGX系列，具备OpenGL和DirectX兼容性，可满足日常办公应用及娱乐需求。
此外，VX700芯片组还提供了丰富的I/O选项，包括多个USB 3.0/2.0端口、高速PCI-E插槽用于扩展显卡、声卡等外设，以及多个SATA III/II接口以连接存储设备。总体而言，VIA VX700芯片组是一款集成了多种功能且具有较高灵活性与效能表现的主板核心组件解决方案。
